# Intel looks beyond silicon, outlines breakthroughs in atomically-thin 2D transistors, chip packaging, and interconnects at IEDM 2024

**URL:** <https://community.materialssquare.com/t/intel-looks-beyond-silicon-outlines-breakthroughs-in-atomically-thin-2d-transistors-chip-packaging-and-interconnects-at-iedm-2024/1020>\
**Category:** News\
**Created:** [December 9, 2024, 5:39pm UTC](https://community.materialssquare.com/t/intel-looks-beyond-silicon-outlines-breakthroughs-in-atomically-thin-2d-transistors-chip-packaging-and-interconnects-at-iedm-2024/1020 "2024-12-09T17:39:53Z")\
**Posts on this page:** 1\
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**Author:** ![gabriele1](https://yyz1.discourse-cdn.com/flex003/user_avatar/community.materialssquare.com/gabriele1/32/20_2.png) [@gabriele1](https://community.materialssquare.com/u/gabriele1)\
**Post date:** [December 9, 2024, 5:39pm UTC](https://community.materialssquare.com/t/intel-looks-beyond-silicon-outlines-breakthroughs-in-atomically-thin-2d-transistors-chip-packaging-and-interconnects-at-iedm-2024/1020/1 "2024-12-09T17:39:53Z")

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This article outlines Intel’s latest advancements showcased at IEDM 2024, focusing on atomically-thin 2D transistors, innovative chip packaging, and advanced interconnect technologies. Intel presented breakthroughs in Gate-All-Around (GAA) RibbonFET transistors, transitioning from traditional FinFET designs to nanosheets for improved performance and scalability. The company is also exploring atomically-thin 2D materials like transition metal dichalcogenides (TMDs) for future transistor technologies. In chip packaging, Intel introduced Selective Layer Transfer (SLT) for efficient chip-to-wafer assembly and unveiled EMIB-T, a new interconnect solution using TSVs for high-speed, low-power communication. These developments aim to enhance semiconductor efficiency, scaling, and integration for next-generation computing applications.

For more details, please continue reading the full article under the following link:

> **[Intel looks beyond silicon, outlines breakthroughs in atomically-thin 2D...](https://www.tomshardware.com/pc-components/cpus/intel-looks-beyond-silicon-outlines-breakthroughs-in-atomically-thin-2d-transistors-chip-packaging-and-interconnects-at-iedm-2024)**
>
> Smaller, faster, better.

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In general, if you enjoy reading this kind of scientific news articles, I would also be keen to connect with fellow researchers based on common research interests in materials science, including the possibility to discuss about any potential interest in the Materials Square cloud-based online platform ( [www.matsq.com](http://www.matsq.com) ), designed for streamlining the execution of materials and molecular atomistic simulations!

Best regards,

Dr. Gabriele Mogni  
Technical Consultant and EU Representative  
Virtual Lab Inc., the parent company of the Materials Square platform  
Website: [Home | Virtual Lab Inc.](http://www.virtuallab.co.kr/en/)  
Email: gabriele@simulation.re.kr

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