A solvent-free processed low-temperature tolerant adhesive

Researchers have developed a solvent-free, low-temperature tolerant adhesive using polyoxometalates (POMs) and polyethylene glycol (PEG). This adhesive exhibits excellent adhesion strength, stability, and performance in temperatures ranging from -196°C to 55°C, surpassing conventional adhesives. The strong interaction between POMs and PEG enhances cohesion strength and prevents volumetric contraction at low temperatures. The adhesive can be easily scaled up for practical applications in extreme environments such as Arctic/Antarctic and outer space exploration.

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